Characterization of elastic-plastic properties of intermetallic compounds

摘要

A modified analysis methodology based on Dao et al.'s approach, which integrates large deformation finite element (FE) simulation of sharp nanoindentation and dimensional analysis is proposed for determining the plastic properties of two commonly observed IMCs (Cu6Sn5 and Cu3Sn) in a solder interconnect from experimental nanoindentation responses. By the modified analysis methodology incorporating with the parametric FE analysis results of nanoindentation, universal dimensionless functions are established, by which a forward and reverse analysis algorithm is constructed for predicting nanoindentation responses directly from known elastic-plastic properties, and vice versa, respectively. The effectiveness of the modified analysis methodology is verified by the experimental nanoindentation responses and limited literature data.