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Thermal modelling of fittings for high temperature low sag conductors

机译:高温低洼导体配件的热建模

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With the use of high-temperature low sag (HTLS) conductors, high operating temperatures (> 200 deg C) are possible which require a reconsideration of test and design specifications for fittings used to tension, support and connect the conductor. A promising approach for the consideration of thermally induced ageing effects of fittings materials is the determination of the real thermal load experienced during service due to current and weather conditions. With this approach, a cumulative temperature frequency distribution can be determined over the life time of a fitting. Based on ageing models, this distribution can be related to the change in a given ageing property value over the operation time. In turn, this can be used to define test specifications that can reflect this ageing process in tests. In order to create temperature frequency distributions of fittings, valid thermal simulation models are necessary which are presented in this paper. Due to the complexity of some fittings, two approaches are pursued: 3D FEM model and a simplified 1D model. Both models can be used to calculate steady state temperature distributions along fittings as a function of current, wind speed, ambient temperature and global radiation. In this paper measured and calculated values are presented for two selected arrangements of conductor and fitting: A wedge-type tension clamp used for invar core conductors and a compression mid span joint used for conductors with composite cores. For both simulation approaches a satisfactory match with experiment is achieved. In most cases, the FEM model show slightly smaller deviations from the experiment. However, the calculation time of the 1D model is significantly lower compared to the FEM model. The satisfactory accuracy of the 1D model makes it suitable for the calculation of extensive current and weather scenarios. For an accurate calculation of the temperatures with the presented models, a precise knowledge of the parameters (geometry, material parameters etc.) is required.
机译:通过使用高温低凸张(HTLS)导体,可以进行高工作温度(> 200℃),需要重新考虑用于张力,支撑和连接导体的配件的测试和设计规范。考虑热诱导的配件材料的老化效果的有希望的方法是确定由于当前和天气条件的服务期间经历的真正热载荷。利用这种方法,可以在配件的寿命时间内确定累积温度分布。基于老化模型,该分布可以在操作时间内与给定老龄化性价值的变化有关。反过来,这可以用于定义可以反映测试中的测试规范。为了创建配件的温度分布,需要有效的热仿真模型,本文介绍。由于某些配件的复杂性,追求了两种方法:3D FEM模型和简化的1D模型。这两种型号可用于沿配件计算稳态温度分布,作为电流,风速,环境温度和全球辐射的函数。在本文中,针对导体和配件的两个选定的布置提供测量和计算值:用于INVAR芯导体的楔形张力夹具和用于具有复合芯的导体的压缩中间跨度接头。对于两种模拟方法,实现了与实验的令人满意的匹配。在大多数情况下,有组织模型显示出与实验略微较小的偏差。然而,与FEM模型相比,1D模型的计算时间显着降低。 1D模型的令人满意的精度使其适用于计算广泛的电流和天气情况。为了准确计算具有所提出的模型的温度,需要精确了解参数(几何,材料参数等)。

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