Small Scale Tensile Testing of Grain Boundary Strength of X-750 Alloy

摘要

Tensile tests of notched micropillars in focused ionbeam (FIB) system were performed to measure the grainboundary strength of X-750 alloy. Grain boundarycharacter was measured by electron back scatteringdiffraction (EBSD) before the FIB lift-out. Micropillars ofboth low angle grain boundary (LAGB) and high anglegrain boundary (HAGB) were prepared and in situ testedunder tensile stress in FIB system. Finite elementmodeling (FEM) was used to simulate stress duringtensile tests and calculate grain boundary fracturestrength.