This paper presents a reliability evaluation on an ASIC(application specific integrated circuit) flash RAM using an acceleratedlife test. The accelerated stress applied on the life test is acombination of temperature and humidity using a step-stress profile.Reliability assessment is conducted by using the Peck combination modelto quantify the acceleration factors, and convert the operation cyclesat various high temperature and humidity conditions to the equivalentcycles at normal operation condition. The Weibull analysis is alsoconducted based on the cumulative equivalent test time for each PCB.Mean time to failure (MTTF) and the cumulative failure probabilitieswere calculated for one-year operation, five-year operation, and the40000 power on- and-off cycles of design specification. The technique ofthe accelerated life test and reliability assessment presented in thispaper can be used in other similar programs and reliability assessment
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