The application of scanning acoustic microscopy to dielectricpolymer composite material study

摘要

Acoustic microscopy is an effective method for visualization andquantitative analysis of physico-mechanical properties andmicrostructure of dielectric polymer blends and polymer composites. Itallows one to use this method for investigating a wide variety of opaquematerials and obtaining information about their inner structure as wellas for optically transparent materials in which the contrast betweendifferent structures is practically absent. The methods of acousticmicroscopy turns out to be very sensitive to any kind of inhomogenetiesas well as various bulk defects: microcracks, pours, adhesiondisturbance, exfoliation, inclusions, deviations from the giventhickness off the layer in multilayered system and coating,technological deviations of sizes, orientation and grain distribution.In this work, the authors present experimental results investigation oftwo groups of objects. First is, polyethylene-polystyrene mixture filmsproduced by different methods, where acoustic images clearly reveal theinternal distribution of phases for each technological process. Thesecond group is a multilayer dielectric structure, formed by differentkinds of polymer, such as high density polyethylene, polyamide orethylene vinyl alcohol, etc. In this case methods were used fornondestructive measurement of the thickness of multilayer polymercomposite and adhesive layer and defect inspection