Reliability assessment of compression contacts for socketablecomponents

摘要

A feasibility study was performed to assess the reliabilityperformance of a CPU packaging technology with a potential newcompression socket technology. The feasibility study was based on anewly adopted mechanistic based methodology at Intel, called the usecondition methodology, for performing reliability evaluations. In thisstudy, the effects of the electronic package interconnect land goldthickness on the behavior of contact resistances through noncyclictemperature and humidity and fretting motion are detailed. The initialassessment of field use conditions requirements for temperature,humidity, and fretting are described. Mechanical and failure ratemodeling results are used to aid in assessing the possible failmechanisms and to help identify possible solutions for these failmechanisms. Accelerated testing data was then collected at multiplestress conditions, i.e. bake, temperature and humidity, and highlyaccelerated stress testing (HAST), to identify acceleration factors fortemperature and humidity effects. Fretting evaluations were alsoperformed to assess the performance and to estimate the life of thetechnology. A risk assessment is given on the feasibility of this typeof technology for a specific computing environment using the usecondition methodology. Finally, the results of the feasibilityassessment are compared and contrasted to the standards basedmethodology that was used at Intel for CPU package and associatedenabling evaluations (where enabling includes items such as sockets andthermal solutions)