PCB Embedded Chip-on-Chip Packaging of A 48 kW SiC MOSFET DC-AC Module with Double-Side Cooling Design

摘要

Packaging technology is a major challenge to tapping the performance potential of wide bandgap devices. This paper proposes a packaging design based on the printed circuit board embedded technology, chip-on-chip concept, and pressure-based contact. A silicon carbide DC-AC power module with 800V maximum voltage and 48kW continuous power is designed, which has an ultra-tiny volume dimensioned with 90 mm length, 40 mm width, and 3 mm thickness. By vertically stacking the two dies of one phase leg, the conduction path is shortened which leads to a low stray inductance. In this design, ceramic sheets are used to replace the conventional thermal interface material. Proper contacts between the module, the ceramic sheets, and the cooling system are achieved by applying clamping force. The electrical performance and thermalmechanical performance of the proposed design are evaluated by finite element analysis, including temperature distribution, thermal stress distribution, and the conduction loop stray inductance.