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Fast and Accurate High-Sigma Failure Rate Estimation through Extended Bayesian Optimized Importance Sampling

机译:通过扩展的贝叶斯优化重要性采样快速,准确地估计高西格玛故障率

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Due to the aggressive technology downscaling, process variations are becoming pre-dominent, causing performance fluctuations and impacting the chip yield. Therefore, individual circuit components have to be designed with very small failure rates to guarantee functional correctness and robust operation. The assessment of high-sigma failure rates however cannot be achieved with conventional Monte Carlo (MC) methods due to the huge amount of required time-consuming circuit simulations. To this end, Importance Sampling (IS) methods were proposed to solve the otherwise intractable failure rate estimation problem by focusing on high-probable failure regions. However, the failure rate could largely be underestimated while the computational effort for deriving them is high. In this paper, we propose an eXtended Bayesian Optimized IS (XBOIS) method, which addresses the aforementioned shortcomings by deployment of an accurate surrogate model (e.g. delay) of the circuit around the failure region. The number of costly circuit simulations is therefore minimized and estimation accuracy is substantially improved by efficient exploration of the variation space. As especially memory elements occupy a large amount of on-chip resources, we evaluate our approach on SRAM cell failure rate estimation. Results show a speedup of about 16x as well as a two orders of magnitude higher failure rate estimation accuracy compared to the best state-of-the-art techniques.
机译:由于积极的技术缩减规模,工艺变化正变得越来越普遍,从而导致性能波动并影响芯片成品率。因此,必须将单个电路组件的故障率设计得很小,以确保功能正确性和稳健的操作。但是,由于需要大量耗时的电路仿真,因此无法使用常规的蒙特卡洛(MC)方法来评估高西格玛故障率。为此,提出了重要采样(IS)方法,通过关注高概率故障区域来解决原本难以解决的故障率估计问题。但是,在推导它们的计算量很大的情况下,故障率可能会大大低估。在本文中,我们提出了一种扩展的贝叶斯优化IS(XBOIS)方法,该方法通过在故障区域周围部署电路的精确替代模型(例如延迟)来解决上述缺点。因此,通过有效地探索变化空间,可以最大程度地减少昂贵的电路仿真次数,并显着提高估计精度。由于特别是存储元件占用了大量的片上资源,因此我们评估了有关SRAM单元故障率估计的方法。结果显示,与最佳的最新技术相比,其速度提高了约16倍,故障率估算精度提高了两个数量级。

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