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Design of Additively-Manufactured Lattice Structure for Thermal Protection System: Thermal Characterization and Transient Performance

机译:用于热保护系统的粘液制造晶格结构的设计:热表征和瞬态性能

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Lattice structure can decrease the apparent thermal conductivity of material produced by Additive Manufacturing (AM) technology. To design the insulating layer for Thermal Protection System (TPS) with lattice structure, it is critical to consider both effective thermal conductivity and diffusivity of the structure. The study intends to explore the impact of lattice topology on the global transient insulating performance. Four different lattice designs: solid, simple cube, semi-fishbone (I-channel and C-channel), and hybrid design are compared by measuring their apparent thermal conductivity and heat-soaked temperature in transient heating test. All lattice structures design shows lower apparent thermal conductivity compared to solids. The simple cube has the lowest averaging apparent thermal conductivity (0.185 W/(mk)), followed by hybrid (0.215 W/(m·k)), and C-channel design (0.229 W/(mk)). During the transient heating test, the hybrid design shows lower backside temperature (38.645 °C ) than solid (average backside temperature: ~45 °C ) and demonstrates the global distribution of lattice structure can vary the insulating capability for TPS designs.
机译:格子结构可以降低添加剂制造(AM)技术生产的材料的表观导热率。设计具有晶格结构的热保护系统(TPS)的绝缘层,考虑结构有效导热性和结构的扩散性至关重要。该研究打算探讨晶格拓扑对全球瞬态绝缘性能的影响。四种不同的格子设计:通过测量瞬态加热试验中的表观导热性和热浸湿温度来比较固体,简单的立方体,半鱼叉(I沟道和C沟道)和混合设计。与固体相比,所有晶格结构设计表现出较低的表观导热率。简单的立方体具有最低的平均表观导热率(0.185W /(MK)),其次是杂种(0.215W /(M·K))和C沟道设计(0.229W /(MK))。在瞬态加热测试期间,混合设计显示低于固体(38.645°C)的较低的背面温度(平均背面温度:〜45°C),并证明了格子结构的全球分布可以改变TPS设计的绝缘能力。

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