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2.2 AMD Chiplet Architecture for High-Performance Server and Desktop Products

机译:2.2适用于高性能服务器和台式机产品的AMD Chiplet体系结构

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AMO's “Rome” and “Matisse” are second-generation AMD Infinity Fabric-based SoCs using 3 unique hybrid process technology chiplets to achieve leading performance, performance/$ and performance/W, targeting server and client markets, respectively (Fig. 2.2.1). The chiplet architecture enables leading edge 7nm [1] CPUs for multiple markets, while retaining backward compatibility to complex 10 and memory subsystems in a scalable design with high reuse for improved time-to-market. A key benefit is the heterogeneous technology deployed between the CPUs and the 10/mixed-signaIP. It is well known that shrink factors in advanced nodes are much lower for analog circuitry than for digital logic and SRAM. By keeping the memory interfaces and SerOes in mature 12nm technology, costs are mitigated since those circuits see a very small shrink factor to 7nm and very little performance or power gain from advanced nodes. A low-cost 12nm 10 die (IOD) with the high-yielding 8 “Zen2” core, 74mm2 7nm CPU compute die (CCD) combine to provide very cost-effective performance.
机译:AMO的“罗马”和“ Matisse”是第二代基于AMD Infinity Fabric的SoC,使用3种独特的混合处理技术小芯片来分别针对服务器和客户端市场实现领先的性能,性能/美元和性能/ W(图2.2)。 1)。小芯片架构可为多个市场提供领先的7nm [1] CPU,同时在可扩展设计中以高重复使用率保持对复杂10和内存子系统的向后兼容性,从而缩短了产品上市时间。一个关键的好处是在CPU和10 / mixed-signaIP之间部署了异构技术。众所周知,与数字逻辑和SRAM相比,模拟电路的高级节点中的收缩因子要低得多。通过将存储器接口和SerOes保持在成熟的12nm技术中,可以降低成本,因为这些电路的收缩系数非常小,仅为7nm,而高级节点的性能或功率增益也很小。低成本12nm 10芯片(IOD),具有高产量的8“ Zen2”内核,74mm 2 7纳米CPU计算芯片(CCD)结合起来可提供非常经济高效的性能。

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