Wave Propagation Modeling for mmWave and Terahertz Wireless Networks-on-Chip Communications

摘要

Wireless networks-on-chip (WiNoC) communications are envisioned as a promising technology to support the interconnection of hundreds of cores in the chip multi-processor design. To meet the future demand for Tera-bit-per-second (Tbps) ultra-fast links in the WiNoC, the millimeter wave (mmWave) and Terahertz (THz) bands with ultra-broad spectrum resource are proposed for WiNoC communications. In this paper, a hybrid WiNoC architecture and the stratified chip design are described, in which the flip-chip package and heat sink are considered. The electromagnetic fields in the WiNoC stratified medium are theoretically analyzed and verified with full-wave simulation. Based on the developed channel model, the WiNoC propagation is characterized by analyzing the path loss, the channel capacity and the reliability. Furthermore, the impact and guideline of the chip design on the WiNoC wave propagation are extensively evaluated and investigated. In particular, the wave propagation performance in THz WiNoC channel can be improved, by decreasing the underfill thickness, proper choice of the silicon thickness and inserting a bottom layer below the silicon substrate.