Low-Loss 19 Core Fan-in/Fan-out Device using Reduced-Cladding Graded Index Fibers

机译：低损耗，19芯扇出/扇出设备，采用低包层渐变折射率光纤

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

We demonstrate a 19-core fan-in/fan-out device with low insertion loss using reduced-cladding graded index fibers and micro-structured preform. The average insertion loss for a pair of devices spliced to 3m of 19 core trench-assisted multicore fiber is 1.27 dB.

机译：我们展示了使用减少包层渐变折射率纤维和微结构预成型件的低插入损耗的19芯扇入/扇出设备。拼接到19m沟槽辅助多芯光纤的3m上的一对设备的平均插入损耗为1.27 dB。

著录项

来源
《Optical Fiber Communications Conference and Exhibition》|2019年|1-3|共3页
会议地点
作者
Juan Carlos Alvarado-Zacarias; J. Enrique Antonio-Lopez; Md. Selim Habib; Stefan Gausmann; Ning Wang; Daniel Cruz-Delgado; Axel Schulzgen; Adrian Amezcua-Correa; Louis-Anne Demontmorillon; Pierre Sillard; Rodrigo Amezcua-Correa;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类
关键词
Multicore processing; Indexes; Crosstalk; Insertion loss; Loss measurement; Optical losses; Fabrication;

机译：多核处理;索引;串扰;插入损耗;损耗测量;光学损耗;制造;

相似文献

外文文献
中文文献
专利

1. Novel Crosstalk Measurement Method for Multi-Core Fiber Fan-In/Fan-Out Devices [J] . Feihong Ye, Hirotaka Ono, Yoshiteru Abe, IEEE Photonics Technology Letters . 2016,第20期

机译：多芯光纤扇入/扇出设备的新型串扰测量方法
2. Multicore-Fiber Receptacle With Compact Fan-In/Fan-Out Device for SDM Transceiver Applications [J] . Kota Shikama, Yoshiteru Abe, Toshiki Kishi, Journal of Lightwave Technology . 2018,第24期

机译：多芯光纤插座，带有紧凑的扇入/扇出设备，适用于SDM收发器应用
3. Concept Demonstration of 3D Waveguides Shuffle Converter for Multi-Core Fiber/Single-Mode Fiber Fan-in Fan-out Configuration Toward Over 1,000 Port Count [J] . Jiang Haisong, Hinokuma Yasuhiro, Ghosh Sampad, IEICE Transactions on Electronics . 2021,第1期

机译：3D波导Shuffle转换器的概念演示为多核光纤/单模光纤风扇的扇形配置朝向超过1,000端口计数
4. Low-Loss 19 Core Fan-in/Fan-out Device using Reduced-Cladding Graded Index Fibers [C] . Juan Carlos Alvarado-Zacarias, J. Enrique Antonio-Lopez, Md. Selim Habib, Optical Fiber Communications Conference and Exhibition . 2019

机译：低损耗19芯扇入/扇出装置，其使用减压分级射击纤维
5. Investigations of polymer-cored solder balls and fan-out technologies in wafer level packaging [D] . Varia, Ronak 2010

机译：晶圆级封装中以聚合物为芯的焊球和扇出技术的研究
6. Low-Loss Hollow Waveguide Fibers for Mid-Infrared Quantum Cascade Laser Sensing Applications [O] . Pietro Patimisco, Vincenzo Spagnolo, Miriam S. Vitiello, 2013

机译：用于中红外量子级联激光传感应用的低损耗空心波导纤维
7. Multicore fibre fan-in/fan-out devices using fibre optic collimators [O] . Jung, Yongmin, Hayes, John, Alam, Shaif-Ul, 2017

机译：采用光纤准直器的多芯光纤扇入/扇出设备
8. Dynamically Programmable Self-Aligning Optical Interconnect with Fan-Out and Fan-In Using Self-Pumped Phase Conjugation. [R] . Cronin-Golomb, M. 1989

机译：采用自泵相位共轭的动态可编程自对准光纤互连，具有扇出和扇入。

Low-Loss 19 Core Fan-in/Fan-out Device using Reduced-Cladding Graded Index Fibers

摘要

著录项

相似文献

相关主题

期刊订阅