3-D Printed RF Amplifier for Wireless Systems

摘要

This paper explores the potential of a 3-D printing technology for the development of radio frequency (RF) systems. Within this study, the design process, simulation, fabrication, and testing of a 3-D printed circuit RF amplifier will be explored. The RF amplifier circuit is fabricated using a 3-D printer capable of depositing a dielectric substrate and metal transmission lines, allowing for double-sided, multilayer circuits of high RF quality. The 3-D printed RF amplifier demonstrated performance as good as one developed with conventional manufacturing techniques up to 6 GHz limited by the active components in the amplifier circuit. The gain difference between the 3-D printed circuit and the conventionally manufactured circuit was less than 1 dB up to 4.7 GHz and less than 1.3 dB up to 6 GHz.