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Process Design Kit and Design Automation for Flexible Hybrid Electronics

机译:柔性混合电子的工艺设计套件和设计自动化

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High-performance low-cost flexible hybrid electronics (FHE) are desirable for internet of things (IoT). Carbon-nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility (25cm2/V.s), superior mechanical flexibility/stretchability, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and integrated with thinned (<;50μm) silicon chips on soft, thin, and flexible substrates for appealing product designs and form factors. Here we report: 1) process design kit (PDK) to enable FHE design automation, from device modeling to physical verification, and 2) open-source and solution-process proven intellectual property (IP) blocks, including Pseudo-CMOS [1] digital logic and analog amplifiers on flexible substrates, as shown in Figure 1. The proposed FHE-PDK and circuit design IP are fully compatible with silicon design EDA tools, and can be readily used for co-design with both CNT-TFT circuits and silicon chips.
机译:高性能低成本柔性混合电子产品(FHE)是物联网(IoT)的理想选择。碳纳米管(CNT)薄膜晶体管(TFT)由于其高载流子迁移率(25cm)而成为高性能FHE的有希望的候选者 2 /V.s),卓越的机械柔韧性/可拉伸性以及与低成本印刷和解决方案工艺的材料兼容性。可以将柔性传感器和外围CNT-TFT电路(例如解码器,驱动器和读出放大器)印刷并与薄的(<;50μm)硅芯片集成在柔软,薄且柔性的基板上,以吸引人的产品设计和外形尺寸。在此我们报告:1)流程设计套件(PDK),以实现从设备建模到物理验证的FHE设计自动化,以及2)开源和解决方案流程经过验证的知识产权(IP)模块,包括Pseudo-CMOS [1]柔性基板上的数字逻辑和模拟放大器,如图1所示。拟议的FHE-PDK和电路设计IP与硅设​​计EDA工具完全兼容,并且可以轻松用于与CNT-TFT电路和硅的协同设计筹码。

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