LLFI: Lateral Laser Fault Injection Attack

摘要

In this work, a novel technique of fault injection attack on secure integrated circuits (ICs) devices is presented: Lateral Laser Fault Injection (LLFI). Laser Fault Injection with backside illumination is typically the most efficient and widely used technique to perturb secure ICs. However, the appearance of new packaging techniques and new physical countermeasures that may block or difficult the IC backside access may limit the efficiency of such technique in the future. In this context, a new Laser Fault Injection alternative is proposed. The IC is attacked through the side of the chip, by focusing the incident laser beam on that area. This novel concept is presented and experimentally proven in this paper.