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Soft X-ray Imaging Telescope (Xtend) onboard X-ray Astronomy Recovery Mission (XARM)

机译:机载X射线天文恢复任务(XARM)上的软X射线成像望远镜(Xtend)

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X-ray Astronomy Recovery Mission (XARM) scheduled to be launched in early 2020's carries two soft X-ray telescopes. One is Resolve consisting of a soft X-ray mirror and a micro calorimeter array, and the other is Soft X-ray Imaging Telescope (Xtend). a combination of an X-ray mirror assembly (XMA) and an X-ray CCD camera (SXI). Xtend covers a field of view (FOV) of 38' x 38'. much larger than that of Resolve (3' × 3') with moderate energy resolution in the energy band from 0.4 keV to 13keV, which is similar to that of Resolve (from 0.3 keV to 12keV). Simultaneous observations of both telescopes provide complimentary data of X-ray sources in their FOV. In particular, monitoring X-ray sources outside the Resolve FOV but inside the Xtend FOV is important to enhance the reliability of super high resolution spectra obtained with Resolve. Xtend is also expected to be one of the best instruments for low surface brightness X-ray emissions with its low non X-ray background level, which is comparable to that of Suzaku XIS. The design of Xtend is almost identical to those of Soft X-ray Telescope (SXT) and Soft X-ray Imager (SXI) both on board the Hitomi satellite. However, several mandatory updates arc included. Updates for the CCD chips are verified with experiment using test CCD chips before finalizing the design of the flight model CCD. Fabrication of the foils for XMA has started, and flight model production of the SXI is almost ready.
机译:计划于2020年初发射的X射线天文恢复任务(XARM)带有两架软X射线望远镜。一种是由软X射线反射镜和微热量计阵列组成的Resolve,另一种是软X射线成像望远镜(Xtend)。 X射线镜组件(XMA)和X射线CCD相机(SXI)的组合。 Xtend的视场(FOV)为38'x 38'。它比Resolve(3'×3')大得多,在0.4 keV至13keV的能带中具有中等的能量分辨率,这与Resolve的分辨率(从0.3 keV至12keV)相似。两种望远镜的同时观测在其视野中提供了X射线源的补充数据。尤其是,监视Resolve FOV外部但Xtend FOV内部的X射线源对于提高使用Resolve获得的超高分辨率光谱的可靠性非常重要。 Xtend还有望成为低表面亮度X射线发射的最佳仪器之一,其非X射线背景水平很低,与Suzaku XIS相当。 Xtend的设计几乎与Hitomi卫星上的软X射线望远镜(SXT)和软X射线成像仪(SXI)的设计相同。但是,其中包括一些强制性更新。在最终确定飞行模型CCD的设计之前,使用测试CCD芯片通过实验验证CCD芯片的更新。 XMA箔的制造已经开始,并且SXI的飞行模型生产已经准备就绪。

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