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A Study of the CMOS Image Sensor Semiconductor Business: Factors Maintaining the Long- Term Manufacturing Technology Superiority of IDM Companies

机译:CMOS图像传感器半导体业务的研究:维持IDM公司长期制造技术优势的因素

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In recent years, semiconductor products have become increasingly important as essential parts of numerous technological devices. In addition, competition is becoming increasingly fierce. Currently, many semiconductor businesses have a horizontal specialization business structure. However, in the CMOS image sensor (CIS) business, vertically Integrated Device Manufacturer (IDM) companies are leading businesses possessing significant technological advantages. This study applies Baldwin's (2004) functional module analysis method to clarify how IDM companies maintain their superiority in CIS, and examines in particular their knowledge acquisition method for improving the main characteristics of CIS. The basic questions this study addresses are why the CIS business has been able to promote the business of IDM companies, and why has it maintained its advantage over the last 10 years. This study seeks to examine this question and present the mechanism behind its superiority. First, the modules of CIS products and development task flow are separated into modules by function and analyzed. The sensor core and system core require different design capabilities. The photodiode of the sensor core is designed through a combination and application of semiconductor physics and optical knowledge by highly expert design, device physics, and process engineers. In IDM companies, development is accomplished in a complementary manner with mutually integrated technologies. We note particularly that the boundary between companies in the horizontal specialization business in the sensor core design affects technological improvement and the speed of growth. During the heyday of SoC in 1990, technology was transferred and production outsourced from the world's top-class IDM to foundries. Based on the current situation two decades later, we analyzed the behavior at that time by back-casting and extracted five growth factors. Five growth opportunities for latecomers to the high-tech manufacturing industry were factors in the current implementation status and effects of the CIS business.
机译:近年来,半导体产品变得越来越重要,作为许多技术设备的基本部位。此外,竞争变得越来越激烈。目前,许多半导体企业具有水平专业化业务结构。然而,在CMOS图像传感器(CIS)业务中,垂直集成的设备制造商(IDM)公司是具有重要技术优势的领先企业。本研究适用Baldwin(2004)功能模块分析方法,以澄清IDM公司如何在CIS中保持其优越性,并审查其知识获取方法,以改善CI的主要特征。本研究地址的基本问题是为什么CIS业务能够促进IDM公司的业务,以及为什么它在过去10年中保持其优势。本研究旨在检查这个问题并展示其优越性背后的机制。首先,CIS产品和开发任务流的模块通过功能分离为模块并分析。传感器核心和系统核心需要不同的设计能力。传感器核心的光电二极管通过高度专家设计,设备物理和工艺工程师组合和应用半导体物理和光学知识设计。在IDM公司中,开发是以相互综合技术的互补的方式完成的。特别注意,传感器核心设计中横向专业化业务的公司之间的边界会影响技术改善和生长速度。在1990年SoC的鼎盛时期,从世界上级别的IDM转移和生产外包给铸造厂。基于目前的情况,稍后二十年,我们通过后铸造并提取了五个生长因子来分析了当时的行为。后期对高科技制造业的五大增长机会是当前实施现状和效力的因素。

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