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Comparative Analysis of Measurement Methods for Assessing the Complex-Deformed State of the Elements of Microelectronic Equipment Made of Elastic Materials

机译:用于评估弹性材料的微电子设备元素复杂变形状态的测量方法的比较分析

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The article discusses possible methods for measuring internal force factors in elements of microelectronic equipment made of elastic materials, using the example of a flexible wheel of harmonic drive, evaluates their positive and negative sides, discusses problems associated with measuring the deformations of elastic materials, and concludes that it is reasonable to use another measurement method.
机译:本文讨论了测量由弹性材料制成的微电子设备元件中的内部力因子的可能方法,使用谐波驱动器的柔性轮的示例,评估它们的正面和负侧,讨论了测量弹性材料变形相关的问题,以及结论是使用另一种测量方法是合理的。

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