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Comparison of Two Model based Temperature Control Systems Implemented on a Three Level T-Type Inverter

机译:三电平T型逆变器上基于两种模型的温度控制系统的比较

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This paper presents two model based temperature control systems to increase the expected lifetime of IGBT-power-modules. The increase of the expected lifetime is achieved by increasing the power losses du ring low load conditions in order to decrease the junction temperature swings of the semiconductor devices in IGBT-power-modules. Each temperature control system uses a different correcting variable. As correcting variables the current amplitude and the switching frequency are used. The temperature control systems are implemented on a three level T-type inverter and the functionality of the temperature control systems is verified by measurements on a machine test bench.
机译:本文介绍了两个基于模型的温度控制系统,以增加IGBT功率模块的预期寿命。通过增加功率损耗DU环低负荷条件来实现预期寿命的增加,以减小IGBT功率模块中的半导体器件的结温摇摆。每个温度控制系统使用不同的校正变量。作为校正变量,使用当前幅度和开关频率。温度控制系统在三级T型逆变器上实现,通过测量在机器测试台上验证温度控制系统的功能。

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