首页> 外文会议>IEEE International Solid- State Circuits Conference >A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm2Die-to-Die Optical Networks
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A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm2Die-to-Die Optical Networks

机译:一个10Gb / s硅光子收发器,具有150μW120μs锁定时间数字监控的模拟微环波长稳定器,用于1Tb / s / mm 2 Die-to-Die光网络

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Silicon photonics has allowed cost reduction and performance improvement for optical interconnects for the past few years, and short-reach wavelength-division-multiplexed (WDM) links have recently emerged thanks to the introduction of microring modulators and filters [1-5]. Nevertheless, the promise of optical networks-on-chip foreseen in [1] has to face the integration challenges of scalable low-footprint elementary drivers and robust operation under heavy thermal stress due to self-heating of the cores with varying loads. This work presents a 3D-stacked CMOS-on-Si-photonic transceiver chip, which includes base building-blocks targeting die-to-die WDM optical communication for multicore processors: 10Gbps 2.5VppOOK modulator driver, associated receiver, and digitally-supervised analog wavelength stabilization using microring heaters and remapping for 0-to-90°C operating range, for a total footprint of 0.01mm2per microring.
机译:硅光态有允许的成本降低和过去几年的光学互连的性能改进,并且由于引入微管调制器和滤波器[1-5],最近出现了短到达波长多路复用(WDM)链路。然而,在[1]中,光学网络的承诺必须面对可扩展的低足迹基本驾驶员的积分挑战,并且由于具有不同负载的核心的自加热而在重热应力下的鲁棒操作。这项工作提出了一种3D堆叠的CMOS-ON-SHOLOCIC收发器芯片,包括针对多核处理器的芯片模具WDM光通信的基础构建块:10Gbps 2.5V pp OOK调制器驱动器,相关接收器和数字监控的模拟波长稳定使用微型加热器和重新映射0至90°C的操作范围,总占地面积为0.01mm 2 每次微型。

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