Modeling and Simulation of Organic MEM Relay for Estimating the Coefficient of Thermal Expansion of PEDOT:PSS

摘要

Thermomechanical properties such as Coefficient of Thermal Expansion of the popular transparent electrode material PEDOT:PSS have not been reported which would be of interest to researchers in the fields of material science and solid state electronics. In a recent paper, our group presented the development of two polymer based (purely and partially polymeric) electrostatically actuated relays, which use PEDOT:PSS as a conductive layer in the three polymer layer movable gate. This paper presents the modeling and simulation of these prototype micro electro mechanical relays on finite element analysis (FEA) software CoventorWare. A number of simulations were run on compound field solver CoSolveEM, using different values of Coefficient of Thermal Expansion of PEDOT:PSS aiming at each of ten available data points on V_(NPI) at different temperatures. From the simulated results an upper estimate of thermal expansion coefficient of PEDOT:PSS was extrapolated.