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Bi-directional flip-chip 28 GHz phased-array core-chip in 45nm CMOS SOI for high-efficiency high-linearity 5G systems

机译:面向45nm CMOS SOI的双向倒装芯片28 GHz相控阵核心芯片,用于高效高线性5G系统

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This paper presents a 0 mW two-channel 28 GHz bi-directional phased-array chip packaged using flip-chip interconnects in 45nm CMOS SOI. The design alternates switched-LC phase shifters with switched attenuators to result in 5-bit phase control with an rms gain and phase error <;0.8 dB and 5°, respectively at 25-33 GHz. In the RX mode, the measured gain is -10 dB and the NF is 10 dB with an input P of 5 dBm. In the TX mode, the measured output P is -2 dBm. This work presents an efficient solution for the construction of high-linearity and high-power phased-array base-stations by combining GaAs front-ends with a passive silicon core chip.
机译:本文提出了一种在45nm CMOS SOI中使用倒装芯片互连封装的0 mW两通道28 GHz双向相控阵芯片。该设计将开关LC移相器与开关衰减器交替使用,以实现5位相位控制,其均方根增益和相位误差分别在25-33 GHz时分别小于<0.8 dB和5°。在RX模式下,输入P为5 dBm时,测得的增益为-10 dB,NF为10 dB。在TX模式下,测得的输出P为-2 dBm。通过将GaAs前端与无源硅核心芯片相结合,这项工作为构建高线性度和高功率相控阵基站提供了一种有效的解决方案。

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