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12.3 A low-power and high-performance 10nm SRAM architecture for mobile applications

机译:12.3适用于移动应用的低功耗高性能10nm SRAM架构

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Mobile applications, such as smartphones streaming HD videos or virtual-reality headsets rendering 3D landscapes, need SRAM memories that can be put in a low-power state to extend battery life, but can also offer high performance operation when required [1]. This paper will merge a 10nm technology with a dual-rail SRAM architecture to achieve superior power savings and performance scaling in comparison to the previous 16nm technology node [2]. Due to its simple design and area efficient layout, the 6T SRAM bitcell continues to be the primary memory technology used in almost all SoC and processor designs in high volume manufacturing today. The 10nm technology uses low-leakage, high-performance, second-generation FinFET transistors; it also offers a 6T cell (0.042µm2), for area and power savings, that does not require read or write assist circuits to achieve low voltage (Vmin) operation. This bitcell uses a fin ratio of 1∶2∶2 (PU:PG:PD), as illustrated in Fig. 12.3.1.
机译:移动应用程序(例如,流式处理高清视频的智能手机或渲染3D风景的虚拟现实耳机)需要SRAM存储器,这些存储器可以置于低功耗状态以延长电池寿命,但在需要时也可以提供高性能的操作[1]。与先前的16nm技术节点相比,本文将10nm技术与双轨SRAM架构相结合,以实现卓越的节能和性能扩展。由于其简单的设计和高效的布局,6T SRAM位单元仍然是当今大批量生产中几乎所有SoC和处理器设计中使用的主要存储技术。 10纳米技术使用低泄漏,高性能的第二代FinFET晶体管。它还提供6T电池(0.042µm2),以节省面积和功耗,不需要读或写辅助电路即可实现低电压(Vmin)操作。如图12.3.1所示,该位单元的鳍比为1∶2∶2(PU:PG:PD)。

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