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THE INVESTIGATION ON THE INTERMETALLIC LAYER OF HOT DIPPING Al-10Si ALLOY WITH 22MnB5 AND DC51 SUBSTRATE

机译:用22MnB5和DC51基质热浸Al-10Si合金中间层的研究。

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Hot-dipping Al-Si coating of 22MnB5 steel and DC51 steel were done in molten Al-Si bath with about 10%Si for different dipping time ranging from 3 to 300 seconds, at the temperature of 660°C, 680°Cand 700°C. To study the influence of different matrix, temperature and dipping time on the intermetallic layer, the microstructure of the intermetallic layer was observed by scanning electron microscope(SEM) with energy dispersive spectroscopy(EDS). The results show that the both intermetallic layers are mainly composed of Fe_2Al_5 and Al_9Fe_2Si_2._(10) Al_9Fe_4Si_3 was found near the boundary of Fe_2Al_5 and Al-Fe-Si intermetallic layer when the dipping time up to 300s. It also shows that the growth rate of interfacial layer on the 22MnB5 substrate is bigger than the intermetallic layer on DC51 steel at the same temperature (660°C, 700°C) except 680°C in a certain time range.
机译:在温度约为660°C,680°C和700°C的Al-Si熔池中,以约10%Si的温度对22MnB5钢和DC51钢进行热浸Al-Si涂层,浸入时间从3到300秒不等C。为了研究不同的基体,温度和浸渍时间对金属间化合物层的影响,通过扫描电子显微镜(SEM)和能量色散光谱仪(EDS)观察了金属间化合物层的微观结构。结果表明,两个金属间层均主要由Fe_2Al_5和Al_9Fe_2Si_2组成。_(10)在浸渍时间达到300s时,在Fe_2Al_5和Al-Fe-Si金属间层的边界附近发现了Al_9Fe_4Si_3。这也表明,在一定温度范围内(680℃,700℃),在相同的温度(660℃,700℃)下,22MnB5基体上的界面层的生长速率要大于DC51钢上的金属间层的生长速率。

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