The use of polymer films for thorough protection of electronic equipment during shipment or storage should take into account the prevention of electrostatic discharge (ESD), corrosion, and the disposal of the film after use. A main property that makes an polymer film a viable packaging material for electronic equipment is the film's ability to eliminate electrostatic discharge. For static dissipative and conductive materials, a significant amount is incorporated into an entire layer of the film, which causes the film to become static dissipative or conductive. Anti-stat materials are a prime candidate to use for the prevention of ESD damage. The most recent property addition to this film is biodegradability. There is an industrial need for a biodegradable film with similar properties and price as a non-biodegradable film. An anti-stat biodegradable corrosion (ABC) film is a polymer film that not only provides thorough protection, but offers anti-stat ESD protection, corrosion inhibition, and biodegradation. These film properties facilitate a modern packaging material for electronic equipment that is truly complete. Experimental study in this paper includes laboratory tests such as surface resistively, static decay, razor blade test, VIA test, SO2 test, and ASTM D6400 testing of packaging film. The tests were conducted on two metals: carbon steel and copper, which are often used for electronic devices. The results show that tested ABC film provide static dissipation, prevents corrosion, and biodegrades when exposed to compost conditions.
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