Electrochemical and mechanical behavior of UV curing paint on hybrid films modified with polyethyleneglycol plasticizer applied on tinplate

摘要

The objective of this work is to coat tinplate with a hybrid film obtained from a sol-gel process constituted by the alkoxide precursor tetraethoxysilane (TEOS) and 3-trimethoxysilylpropyl methacrylate (TMSM), with the addition of cerium nitrate (0.01 M) and polyethyleneglycol plasticizer (20 g·L~(-1)) to the sol formulation. The films were obtained by dip-coating, applying one and two layers and curing them at different temperatures (60°C and 90°C) for 20 minutes, and adhering UV curing paint to each film respectively. Films were characterizedby scanning electron microscopy (SEM). FTIR and TGA measurements were performed to characterize the chemical structures of the films. Hybrid films were characterized as by their electrochemical behavior as it pertained to the open circuit potential and electrochemical impedance. Moreover, they were analyzedfor their local ionic current density measurements (using the scanning vibrating electrode technique (SVET).The aforementioned systems were painted and then evaluated for their mechanical testing adhesion and flexibility. Hybrid films with better performance were UV-cured. The results showed that the double layered hybrid film obtained at 60°C had a higher layer of thickness and the best performance in the electrochemical assays it also had the most hydrophobic characteristics in comparison to the other samples. For the monolayered systems, the system cured at 90°C showed a lower layer of thickness; however, this system showed a more compact and uniform yet less porous layer, and it presented better electrochemical impedance results in comparison with the sample cured at 60°C.Furthermore, in studies following the application of UV coating, the hybrid-film monolayer cured at 60 °Cwich had an organic coating of cured UV applied to it, achieved a performance similar to that of the pretreated alkyd greenhouse currently used in the metal packaging industry, which are an environmentally friendly alternative and less process time the current system.