Several fabrication techniques and characterization of the thus obtained epoxy/polyaniline composite films

摘要

Epoxy/PAni composite films were prepared with 1 and 5 wt% of various additives: PAni powder only, epoxy powder surrounded by PAni (epoxy-PAni) and PAni powder surrounded by epoxy (PAni-epoxy). Results of dielectric relaxation spectroscopy showed that with 1 wt% of filler content in epoxy resin, irrespective of the type of additives, the value of AC-conductivity was increased by at least one order of magnitude compared to that of the neat epoxy. In the case of 5 wt% of filler content, the sample containing epoxy-PAni as filler exhibits the highest value (2.3×10-13 S/cm) of AC-conductivity when compared to the one containing PAni-epoxy filler (2.1×10-14 S/cm), both measured at 1 Hz. This is due to the fact that in case of PAni surrounding epoxy powder, `PAni-epoxy', there is a chemical reaction between the PAni and the amine groups present in the curing agent. This reaction changes the oxidation state of PAni compared to the case of epoxy-PAni filler where PAni core is protected by the epoxy shell.