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A compact broadband mixed-signal power amplifier in bulk CMOS with hybrid Class-G and dynamic load trajectory manipulation operations

机译:紧凑型宽带CMOS混合信号功率放大器,具有混合G类和动态负载轨迹操纵操作

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We present a mixed-signal PA with real-time Class-G and dynamic load trajectory manipulation (DLTM) hybrid operations to achieve PA efficiency enhancement up to the deep power back-off (PBO) region. Moreover, the PA load trajectory is dynamically manipulated to achieve PA efficiency peaking during the PBO operation, and the PA load modulation network is realized by only one on-chip transformer balun for an ultra-compact layout. A prototype PA fully integrated in a standard 65nm bulk CMOS process achieves +24.6dBm peak output power (Pout) and 45.6% maximum drain efficiency (DE) at 2.4GHz. By combining the real-time Class-G and DLTM hybrid operations with mixed-signal AM and PM linearization, the PA delivers a +18.5dBm 10MSym/s 64-QAM signal with 32.6% DE and ¿¿¿27.8dB EVM. The DLTM operation also extends the PA Pout 1dB bandwidth by 40%. The total chip area is only 1.9mm2.
机译:我们用实时-G和动态负载轨迹操作(DLTM)混合操作介绍了一个混合信号PA,以实现PA效率提升到深度返回(PBO)区域。此外,PA负载轨迹被动态地操纵以实现PBO操作期间的PA效率峰值,并且PA负载调制网络仅通过一个片上变压器BaluN实现,用于超紧凑的布局。完全集成的原型PA在标准的65nm散装CMOS过程中实现+ 24.6dBm峰值输出功率(POUT)和45.6%的最大排水效率(DE)。通过将实时C类和DLTM混合操作与混合信号AM和PM线性化相结合,PA可提供32.6%DE和¿¿¿27.8db EVM的A + 18.5dbm 10msym / s 64-qam信号。 DLTM操作还将PA POUT 1DB带宽扩展为40%。总芯片面积仅为1.9mm2。

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