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Cross-Sectional Imaging of Directed Self Assembled Block Copolymers

机译:定向自组装嵌段共聚物的截面图

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In this paper we address an important topic for the development of block copolymer directed self assembly, which is the lack of the third dimensional information. The three-dimensional shape of the DSA feature directly impacts the ability to transfer the DSA pattern into etched patterns. Through TEM sample preparation by in-situ focused ion beam (FIB) Pt deposition and milling, we show cross-sectional images for the two most elemental building blocks of directed self assembled block copolymers, namely, the single and double-hole (peanut shape) etched in Si structures with great contrast at the interface formed by PS and PMMA. Additionally, a hard-mask single hole structure processed with a different template material is shown as well. Elemental mapping with energy filtered TEM (EFTEM) was shown to assist interpretation of images. 3D reconstruction of the holes formed in the hard-mask sample was performed using dark field (DF) STEM. A reduction in the SOC and SOG thickness was observed post in-situ Pt deposition for the hard mask structure. Further TEM sample preparation improvements will be needed to minimize the compression observed.
机译:在本文中,我们解决了嵌段共聚物定向自组装发展的重要课题,即缺乏三维信息。 DSA特征的三维形状直接影响将DSA图案转换为蚀刻图案的能力。通过原位聚焦离子束(FIB)Pt沉积和铣削的TEM样品制备,我们显示了定向自组装嵌段共聚物的两个最元素构成的嵌段,即单孔和双孔(花生形状)的横截面图像)在PS和PMMA形成的界面上以很大的对比度在Si结构中蚀刻。此外,还显示了用不同模板材料处理的硬掩模单孔结构。显示了使用能量滤波TEM(EFTEM)进行元素映射,以帮助解释图像。使用暗场(DF)STEM对硬掩模样品中形成的孔进行3D重建。对于硬掩模结构,在原位Pt沉积后观察到SOC和SOG厚度的减少。将需要进一步的TEM样品制备改进以最小化观察到的压缩。

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