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Investigation of the Ag-Cu Ions' Effect on Microbial Activity of Sulphate Reducing Bacteria Leading to Corrosion

机译:Ag-Cu离子对硫酸盐还原菌导致腐蚀的微生物活性影响的研究

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The microbiologically induced corrosion (MIC) of 316L stainless steel (SS) and the effects of Ag-Cu ions on microbial activities of Desulfovibrio sp. regarding to the corrosion of 316L SS were investigated. 316L SS coupons were exposed to the Desulfovibrio sp. cultures with and without Ag-Cu ions during 8, 24, 48, 72, 96, 120, 144, 168, 240, 360, 480, 600 and 720 h in a lab-scaled test systems. Control systems containing sterile Postgate's medium C (PC medium) without Desulfovibrio sp. in the absence and presence of Ag-Cu ions were set to work simultaneously with test systems. Test coupons were removed at each sampling time for enumeration of Desulfovibrio sp., determination of corrosion rate by the weight loss measurement method, and also carbohydrate and protein analysis from extracellular polymeric substances (EPS). Biofilm formation on the 316L SS surfaces were investigated by scanning electron microscopy (SEM). It was found out that Ag-Cu ions affected the growth curve of planktonic Desulfovibrio sp. and caused the entrance of planktonic cells to death phase earlier compared with the ions-free culture. In the presence of Ag-Cu ions, the amounts of carbohydrates and protein produced by Desulfovibrio sp. were significantly higher than that in the ions-free culture (respectively, p< 0.01 and p< 0.001). Desulfovibrio sp. was leading to corrosion of 316L SS in the presence and absence of Ag-Cu ions. However, results showed that Ag-Cu ions with the concentration of 0.3 ppm Cu and 0.13 ppm Ag, effected the metabolism of Desulfovibrio sp. and led to be more corrosive than ions-free culture.
机译:316L不锈钢(SS)的微生物诱导腐蚀(MIC)以及Ag-Cu离子对Desulfovibrio sp。微生物活性的影响。对316L SS的腐蚀进行了研究。 316L SS试样暴露于Desulfovibrio sp。在实验室规模的测试系统中,在8、24、48、72、96、120、144、168、240、360、480、600和720 h内进行含或不含Ag-Cu离子的培养。控制系统包含不带Desulfovibrio sp。的无菌Postgate培养基C(PC培养基)。在不存在和存在Ag-Cu离子的情况下,将其与测试系统同时工作。在每个采样时间取出试样,以进行Desulfovibrio sp。的计数,通过失重测量方法确定腐蚀速率以及从细胞外聚合物质(EPS)中进行碳水化合物和蛋白质分析。通过扫描电子显微镜(SEM)研究了316L SS表面生物膜的形成。发现Ag-Cu离子影响浮游性Desulfovibrio sp。的生长曲线。与无离子培养相比,它使浮游细胞进入死亡阶段。在Ag-Cu离子存在下,Desulfovibrio sp。产生的碳水化合物和蛋白质的量。显着高于无离子培养(分别为p <0.01和p <0.001)。脱硫弧菌在存在和不存在Ag-Cu离子的情况下,导致316L SS腐蚀。然而,结果表明,浓度为0.3 ppm Cu和0.13 ppm Ag的Ag-Cu离子会影响Desulfovibrio sp。的代谢。并导致比无离子培养更具腐蚀性。

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