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Corrosion of printed circuit board assemblies (PCBAs) - Field experience and counter measures

机译:印刷电路板组件(PCBA)的腐蚀-现场经验和对策

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Due to the fact that the population of electronic boards is becoming increasingly smaller and denser its robustness is suffering from it. If no countermeasures are taken, climatic circumstances and impurities on the surface will consequently lead to electrical and functional shortfall. Copper, silver, tin and alloys are widely used on electronic boards to grant electrically and heat conductive properties. Those substances are prone to corrode with the influence of oxygen and humidity. Time to failure is even shorter, when accelerating agents like salts and acids are within reach.
机译:由于电子板的人口越来越小,而且更密集的鲁布利遭受它。如果没有采取对策,因此将导致表面上的气候环境和杂质导致电气和功能性短缺。铜,银,锡和合金广泛用于电子板以授予电和导热性能。这些物质容易腐蚀氧气和湿度的影响。当盐等加速剂在达到范围内时,失败的时间甚至更短。

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