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7.5 A 3.3ns-access-time 71.2μW/MHz 1Mb embedded STT-MRAM using physically eliminated read-disturb scheme and normally-off memory architecture

机译:7.5 A 3.3ns访问时间71.2μW/ MHz的1Mb嵌入式STT-MRAM采用了物理消除的读取干扰方案和常关型存储器架构

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Nonvolatile memory, spin-transfer torque magnetoresistive RAM (STT-MRAM) is being developed to realize nonvolatile working memory because it provides high-speed accesses, high endurance, and CMOS-logic compatibility. Furthermore, programming current has been reduced drastically by developing the advanced perpendicular STT-MRAM [1]. Several-megabit STT-MRAM with sub-5ns operation is demonstrated in [2]. Advanced perpendicular STT-MRAM achieve ~3× power saving by reducing leakage current in memory cells compared with SRAM for last level cache (LLC) [3]. Such high-speed RAM applications, however, entail several issues: the probability of read disturbance error increases and the active power of STT-MRAM must be decreased for higher access speed. Moreover, the leakage power of peripheral circuits must be decreased, because the high-speed RAM requires high-performance transistors having high leakage current in peripheral circuitry [4], limiting the energy efficiency of STT-MRAM. To resolve these issues, this paper presents STT-MRAM circuit designs: a short read-pulse generator with small overhead using hierarchical bitline for eliminating read disturbance, a charge-optimization scheme to avoid excessive active charging/discharging power, and ultra-fast power gating and power-on adaptive to RAM status for reducing leakage power.
机译:非易失性存储器,自旋转移转矩磁阻RAM(STT-MRAM)正在开发中,以实现非易失性工作存储器,因为它具有高速访问,高耐用性和CMOS逻辑兼容性。此外,通过开发先进的垂直STT-MRAM [1],编程电流已大大降低。在[2]中演示了具有5ns以下操作的几兆位STT-MRAM。与用于最后一级缓存(LLC)的SRAM相比,先进的垂直STT-MRAM通过减少存储单元中的泄漏电流实现了约3倍的功耗节省[3]。但是,这样的高速RAM应用涉及几个问题:读取干扰错误的可能性增加,并且为了提高访问速度,必须降低STT-MRAM的有功功率。而且,由于高速RAM需要在外围电路中具有高泄漏电流的高性能晶体管,因此必须降低外围电路的泄漏功率[4],这限制了STT-MRAM的能量效率。为了解决这些问题,本文提出了STT-MRAM电路设计:具有较小开销的短读取脉冲发生器,使用分层位线来消除读取干扰,采用电荷优化方案来避免过多的有源充电/放电功率,以及超快功率门控和上电适应于RAM状态,以减少泄漏功率。

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