EMBEDDED PASSIVE TECHNOLOGY MATERIALS, DESIGN AND PROCESS

摘要

Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 -Ticer's TCR® resistive materials (Foil 25ii/sq NiCr and 1kΩ/sq CrSiO) and Ohmega resistive-Ply materials (Ohmega-Ply 25Ω/sq and 250Ω/sq NiP) were chosen for evaluation. Phase 2 - Due to the high level of complexity and advance materials dielectric, the Digital Imaging Processor unit was chosen as an evaluation vehicle. Process Evaluation for embedded was used to determine present process gaps for laser trimming, fabrication material, raw board test and defining specifications for DFM and layout design.