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Thermal aware energy efficient comparator design using LVMOS IO standards on 28nm FPGA

机译:在28nm FPGA上使用LVMOS IO标准的热感知节能比较器设计

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In this work, our main concern is thermal aware design on 28nm technology based Artix-7 FPGA. Thermal aware means, this design is able to operate in both extreme and normal temperature. LVCMOS (Low voltage Complementary Metal Oxide Semiconductor) is used as IO Standard. Using LVCMOS18, there is 93.03%, 66.58%, and 33.55% reduction in junction temperature, when we scale down ambient temperature from 75 °C to 5 °C, 25 °C and 50 °C respectively. Using LVCMOS25, there is 64.45%, 59.71% and 44.07% reduction in leakage power, when we scale down ambient temperature from 75 °C to 5 °C, 25 °C and 50 °C respectively. In this paper, we have taken two different airflows. Linear Feet per Minute (LFM) is unit of airflow (distance traveled per unit of time). It is either 250 or 500 LFM for the Artix-7 FPGA. TJA is Theta Junction to Ambient (° C/W), Thermal power, TJC (Theta Junction to Case thermal resistance), TCS (Theta Case to hit Sink thermal resistance) and TSA (Theta Sink to Ambient thermal resistance) is also under consideration.
机译:在这项工作中,我们主要关注的是基于28nm技术的Artix-7 FPGA的热感知设计。具有热感知功能,这种设计能够在极端温度和正常温度下工作。 LVCMOS(低压互补金属氧化物半导体)被用作IO标准。使用LVCMOS18,当我们将环境温度分别从75°C降至5°C,25°C和50°C时,结温分别降低了93.03%,66.58%和33.55%。当我们将环境温度分别从75°C降低到5°C,25°C和50°C时,使用LVCMOS25可以将泄漏功率降低64.45%,59.71%和44.07%。在本文中,我们采用了两种不同的气流。每分钟线性英尺(LFM)是气流的单位(每单位时间行进的距离)。对于Artix-7 FPGA,它为250或500 LFM。 TJA也是环境中的Theta结(°C / W),热功率,TJC(Theta结到外壳的热阻),TCS(Theta结到沉的热阻)和TSA(Theta沉到环境的热阻) 。

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