Rogowski current sensor design and analysis based on printed circuit boards (PCB)

摘要

This work presents a new Rogowski current sensor design implemented in printed circuit boards. The proposed structure utilizes a modular design for a variety of applications. Feasibility was first demonstrated using standard printed circuit boards. Test results detail performance with high repeatability with less than 0.8% difference in sensed voltages and less than 0.3% difference in sensed voltages with respect to position of installation. In order to have a less complex, more manufacturable and modular Rogowski current sensor, a flexible printed circuit (FPC) solution was also designed and demonstrated. By using the FPC solution, high sensitivity and much higher power density was achieved. Coupling analysis of a 3-phase system was also conducted both from simulation and experiments.