Device technologies for integrated packaged transceivers

机译：集成包装收发器的设备技术

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Summary form only given. InP-based PICs have enabled a first generation of CFP2-ACO modules for line-side 100Gb/s deployment. A number of options are available to scale to higher volumes and enable high density transport up to 400Gb/s.

机译：摘要表格仅给出。基于INP的PICS启用了第一个用于线路100GB / s部署的CFP2-ACO模块。可以使用多种选项来扩展到更高的卷，并使高密度传输高达400gb / s。

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《Optical Fiber Communications Conference and Exhibition》|2015年||共1页
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Griffin Robert /A/.;
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入库时间 2022-08-21 02:56:09

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2. Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers [J] . Zhang Y.P. IEEE Transactions on Antennas and Propagation . 2004,第2期

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3. Finite-Difference Time-Domain Analysis of Integrated Ceramic Ball Grid Array Package Antenna for Highly Integrated Wireless Transceivers [J] . Y. P. Zhang IEEE Transactions on Antennas and Propagation . 2004,第2期

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4. Device technologies for integrated packaged transceivers [C] . Griffin Robert /A/. Optical Fiber Communications Conference and Exhibition . 2015

机译：集成封装收发器的设备技术
5. Packaging-compatible micromachined magnetic devices: Integrated passive components and modules. [D] . Park, Jae Yeong. 1997

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6. Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices [O] . Jemmy Sutanto, Sindhu Anand, Arati Sridharan, -1

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7. Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices. 3. Optical Modul-Package Technology. [O] . Koji TAKEMURA 1998

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8. Department of Defense Advisory Group on Electron Devices. Special Technology AreaReview on Microwave Packaging Technology. Appendix [R] . 1993

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Device technologies for integrated packaged transceivers

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