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Calibrated time-domain nearfield-immunity test on printed-circuit board level

机译:印制电路板水平的校准时域近场免疫测试

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Field-immunity scanning with small field probes closely above printed-circuit boards allows localizing sensitive circuit areas with high resolution. For quantifying the sensitivity level and to assure repeatable results a suitable calibration method is presented. In contrast to recent approaches based on the forward power supplied to the probe, this paper presents an accurate method using a mini-TEM cell, which allows adjusting the desired field strength at a selected distance. As an extension to previous work restricted to CW signals, in this paper it is shown how the calibration can be performed for arbitrary transient noise signals. Validation is carried out by an exact field-simulation of the near-field coupling into a signal trace. As an application example the Bit Error Ratio (BER) of a simple digital data transmission subject to a trapezoidal noise signal is investigated, depending on repetition rate, probe position and field strength.
机译:利用紧靠印刷电路板上方的小型场探头进行场免疫扫描,可以以高分辨率定位敏感的电路区域。为了量化灵敏度水平并确保可重复的结果,提出了一种合适的校准方法。与基于提供给探头的正向功率的最新方法相反,本文提出了一种使用微型TEM单元的精确方法,该方法可以在选定的距离上调整所需的场强。作为对仅限于连续波信号的先前工作的扩展,本文显示了如何对任意瞬态噪声信号进行校准。通过对近场耦合到信号迹线的精确场仿真来进行验证。作为一个应用示例,根据重复率,探头位置和场强,研究了受梯形噪声信号影响的简单数字数据传输的误码率(BER)。

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