Automotive hybrid and electric vehicle inverter applications demand a packaging technologythat can accommodate large, ultra-thin power semiconductor die, enable high current switchingwith minimum noise, be reliable in operation and efficiently transfer heat to the systemheat sink. COOLiR~2DIETM is a new power device packaging technology targeted for use inhigh power inverter applications. Details of the package construction, thermal resistance andelectrical performance are discussed, including a review of modelled and experimentally determinedresults. Examples of how the packaging technology can be utilized and scaled toenable systems with specific power levels will also be presented.
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