Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection

摘要

The deposition of nano-size copper particles was carried out by means of ink-jet printing on the ceramic substrate (silicon and faience) using Nd~(+3):YAG laser. Glycerin and aqueous based nano copper inks were prepared and were ink-jetted in this study. The sintered copper film had a grainy structure with neck-like junctions. The microstructure and soldering properties were examined using XRD, SEM-EDX and optical microscopy. The dependence of the electrical resistance of the ink-jetted copper interconnection lines on the parameters of laser sintering regimes was estimated.