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Detection of Double-layer Air Gap Defects Based on Terahertz Imaging Method

机译:基于太赫兹成像法检测双层气隙缺陷

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Composite insulators are prone to internal defects and the detection can be more difficult when the defects are overlap in the radial direction. A THz imaging system including THz spectrometer and sample scanning system was designed and set up to detect the defects. The flat sample with double-layer air gap defects of different shapes inside were made to simulate the composite post insulator. We collected reflection waveforms at different locations in the scanning step of 0.5mm based on the THz imaging system. Deconvolution method was used to reduce the pulse width and increase signal-to-noise ratio of the waveform. The method was proven to be effective in making the pulses more distinguishable. Three characteristic parameters, including maximum absolute value, signal power and envelop area were used to imaging the defects. All three parameters were proven to be able to identify double-layer defects which have the depth of 0.40mm and 0.83mm, respectively. Signal power imaging and envelop area imaging have better performances and have different advantages in defect morphology identification and resolution capability.
机译:复合绝缘体容易出现内部缺陷,并且当缺陷在径向方向上重叠时,检测可能更困难。设计并设置了包括THz光谱仪和样品扫描系统的THz成像系统以检测缺陷。采用不同形状的双层空气间隙缺陷的平面样本模拟复合柱绝缘体。基于THz成像系统,我们在0.5mm的扫描步骤中收集了不同位置的反射波形。去卷积方法用于降低脉冲宽度并增加波形的信噪比。证明该方法有效地使脉冲更可区分。三个特征参数,包括最大绝对值,信号功率和包封区域用于成像缺陷。已证明所有三个参数都能够识别具有0.40mm和0.83mm深度的双层缺陷。信号功率成像和包络区域成像具有更好的性能,具有不同的优点,缺陷形态识别和分辨能力。

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