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A 1,000x improvement in computer systems by bridging the processor-memory gap

机译:通过桥接处理器存储器间隙,计算机系统的1,000倍改善

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For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.
机译:超过4年,计算机处理速度和内存访问之间的差距在每年大约50±50℃下增加到1,000倍。这提供了增强单核系统性能的绝佳机会。建议采用创新的3D集成技术与重新构建集成存储器设备相结合,以弥合间隙,并在计算机系统中实现1,000 X的改进。所提出的技术利用广泛可用的流程,可以在很短的时间内集成在产品中。

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