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Effects of low noise amplifier under high power microwave back-door coupling

机译:大功率微波后门耦合对低噪声放大器的影响

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The back-door coupling effects of the low noise amplifier (LNA) under high power microwave (HPM) has been studied in this paper. First, a low noise amplifier is designed by the circuit simulation software Advanced Design System(ADS), then the LNA circuit is imported in to the High Frequency Simulator Structure(HFSS) to carry out the hybrid analysis of back-door coupling effects of HPM on LNA. We get the voltage of the gate and drain terminals of the LNA transistor. After that, the voltage is regarded as an interference signal, and is added to the transistor's corresponding pin, which is simulated by ADS. All above operations are aimed at comparing the changes in gain and noise figure before and after adding the interference signal to the LNA. At last, it is concluded that special protection should be put on signal input pins, and this can be used as a guide to provide protection to the LNA from back door coupling of high power microwave in application.
机译:本文研究了低噪声放大器(LNA)在高功率微波(HPM)下的后门耦合效应。首先,通过电路仿真软件Advanced Design System(ADS)设计一个低噪声放大器,然后将LNA电路导入到高频仿真器结构(HFSS)中,以进行HPM后门耦合效应的混合分析。在LNA上。我们得到LNA晶体管的栅极和漏极端子的电压。之后,该电压被视为干扰信号,并被加到晶体管的相应引脚,该引脚由ADS模拟。所有上述操作旨在比较将干扰信号添加到LNA之前和之后的增益和噪声系数变化。最后得出结论,在信号输入引脚上应加特殊保护,可以作为指导,为应用中的大功率微波后门耦合保护低噪声放大器。

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