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IMPROVEMENT OF HEAT TRANSFER PERFORMANCE OF LOOP HEAT PIPE FOR ELECTRONIC DEVICES

机译:电子设备环热管传热性能的改进

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In this paper is presented the results on performance of the cooling model using Loop Heat Pipe (LHP) system. In recent years, ever-ending demand of high performance CPU led to a rapid increase in the amount of heat dissipation. Consequently, thermal designing of electronic devices need to consider some suitable approach to achieve high cooling performance in limited space. Heat Pipe concept is expected to serve as an effective cooling system for laptop PC, however, it suffered from some problems as follows. The heat transport capability of conventional Heat Pipe decreases with the reduction in its diameter or increase in its length. Therefore, in order to use it as cooling system for future electronic devices, the above-mentioned limitations need to be removed. Because of the operating principle, the LHP system is capable of transferring larger amount of heat than conventional heat pipes. However, most of the LHP systems suffered from some problems like the necessity of installing check valves and reservoirs to avoid occurrence of counter flow. Therefore, we developed a simple LHP system to install it on electronic devices. Under the present experimental condition (the working fluid was water), by keeping the inside diameter of liquid and vapor line equal to 2mm, and the distance between evaporator and condenser equal to 200mm, it was possible to transport more than 85W of thermal energy. The thickness of evaporator was about 5mm although it included a structure to serve the purpose of controlling vapor flow direction inside it. Successful operation of this system at inclined position and its restart capability are confirmed experimentally. In order to make the internal water location visible, the present LHP system is reconstructed using transparent material. In addition, to estimate the limit of heat transport capability of the present LHP system using this thin evaporator, the air cooling system is replaced by liquid cooling one for condensing device. Then this transparent LHP system could transport more than 100W of thermal energy. However, the growth of bubbles in the reserve area with the increase in heat load observed experimentally led to an understanding that in order to achieve stable operation of the LHP system under high heat load condition, it is very much essential to keep enough water in the reserve area and avoid blocking the inlet with bubbles formation.
机译:本文介绍了使用回路热管(LHP)系统的冷却模型的性能结果。近年来,对高性能CPU的不断需求导致散热量迅速增加。因此,电子设备的热设计需要考虑一些合适的方法,以在有限的空间内实现高冷却性能。热管概念有望用作笔记本电脑的有效冷却系统,但是它存在以下一些问题。常规热管的传热能力随着其直径的减小或长度的增加而减小。因此,为了将其用作未来电子设备的冷却系统,需要消除上述限制。由于工作原理,与传统的热管相比,LHP系统能够传递更多的热量。但是,大多数LHP系统都存在一些问题,例如必须安装止回阀和储液罐以避免产生逆流。因此,我们开发了一个简单的LHP系统以将其安装在电子设备上。在当前的实验条件下(工作流体是水),通过使液体和蒸气管线的内径等于2mm,并且蒸发器和冷凝器之间的距离等于200mm,可以输送超过85W的热能。蒸发器的厚度为约5mm,尽管其包括用于控制其内部的蒸气流向的结构。实验证实了该系统在倾斜位置的成功运行及其重启能力。为了使内部水的位置可见,本LHP系统是使用透明材料重建的。另外,为了估计使用该薄蒸发器的当前LHP系统的热传递能力的极限,将空气冷却系统替换为用于冷凝装置的液体冷却系统。然后,这种透明的LHP系统可以传输超过100W的热能。但是,通过实验观察到,随着热负荷的增加,储备区域中的气泡会增加,这使人们认识到,为了在高热负荷条件下实现LHP系统的稳定运行,在水箱中保持足够的水非常重要。保留区域,避免阻塞入口,形成气泡。

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