Thin Al-Ta-O Mixture Coatings Prepared with Atomic Layer Deposition for Corrosion Protection of Steel

摘要

Atomic Layer Deposition (ALD) is a chemical vapour deposition (CVD) based method for thin film deposition. It was originally developed for electroluminescent displays, but is now used in a wide variety of applications including microelectronics, magnetic heads and protective layers. In ALD the precursors are introduced individually to the substrate surface and separated by inert gas purging. Therefore film growth proceeds only on the substrate depositing a (sub)monolayer of film per cycle. Owing to the growth mechanism very uniform, conformal and low defect density films can be grown even on challenging 3D substrates.