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THERMAL AND ELECTRICAL PROPERTIES OF PA 11 / NANOGRAPHENE PLATELET NANOCOMPOSITES

机译:PA 11 /纳米石墨片纳米复合材料的热电性能。

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The scope of this research is to evaluate thermal and electrical properties of polyamide 11(PA 11)anographene platelet (NGP) nanocomposites. Previous research and analysis ofnanographene suggests that the improved thermal properties are ideal for application as athermal management layer in microelectronic devices, lightning protection in aircraft, andthermally conductive films. The main processing technique used was sonication for mixingof PA 11 and NGPs. Samples were prepared using 1 wt%, 3 wt% and 5 wt% by weightNGPs. Isopropyl alcohol (IPA) was used as a solvent to assist in dispersion of the NGPswithin PA 11. The resultant solution of PA 11/NGPs was heated to between 80-85 °C inorder to evaporate the IPA and then placed in a compression press between aluminum foils at205°C and used to produce a thin film for testing. Thermal characterization ofnanocomposites includes thermogravimetric analysis (TGA) and Thermomechanical Analysis(TMA) at the heating rate of 20 °C/min. Electrical resistivity was also measured.
机译:本研究的范围是评估聚酰胺11的热和电性能 (PA 11)/纳米石墨烯血小板(NGP)纳米复合材料。以前的研究和分析 纳米石墨烯表明,改进的热性能非常适合作为碳纳米管应用 微电子设备中的热管理层,飞机中的雷电防护以及 导热膜。使用的主要加工技术是超声处理以进行混合 PA 11和NGP。使用1重量%,3重量%和5重量%的重量制备样品 NGP。异丙醇(IPA)被用作溶剂以帮助NGP分散 在PA 11内。将所得的PA 11 / NGPs溶液在室温下加热到80-85°C 为了使IPA蒸发,然后将其放在铝箔之间的压缩压力机中, 205°C并用于生产测试薄膜。热表征 纳米复合材料包括热重分析(TGA)和热力学分析 (TMA)以20°C / min的加热速率进行加热。还测量了电阻率。

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