Film Capacitors with Integral Water Cooling Provide Efficient Heat Transfer and System Thermal Management.

摘要

An increasing number of power electronic systems require All Film with Foil and Metallized Film capacitors to handle high currents. These systems may rely on water cooled chill plates to cool their semiconductors and sometimes other components such as capacitors. However, the addition of integral water cooling to film capacitors is a proven technique that until recently was used primarily in Induction Heating applications. The methods used in the Induction Heating or Furnace applications have an established reliability over a period exceeding forty years. The transfer of heat using various types of integral water cooling methods for film capacitors is demonstrated in this study as well as its effect on capacitor performance. The study also shows how this heat transfer allows a material and cost reduction for an entire power electronic system.