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Numerical simulation of electromagnetic pulse coupling into computer enclosure with apertures

机译:电磁脉冲耦合到带孔计算机机箱的数值模拟

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for thermal design and assembly reason, there inevitably exist thermal aperture arrays and slots on computer enclosure, so electromagnetic pulse will get into enclosure through these apertures, which is called “back-door coupling”. This paper simulates and computes the computer enclosure''s apertures coupling effects caused by electromagnetic pulse by using Transmission Line Matrix Method (TLM). Change and distribution plots with time of the coupling electric field are analyzed. The influence of propagation direction and polarization direction on the coupling electric field in enclosure is discussed, and the strongest and weakest coupling approach is given in the paper. All of these apply quantified basis for studying electromagnetic protection and electromagnetic compatibility of computer.
机译:由于散热设计和组装的原因,计算机机壳上不可避免地存在散热孔阵列和插槽,因此电磁脉冲会通过这些孔进入机箱,这称为“后门耦合”。本文使用传输线矩阵法(TLM)模拟和计算由电磁脉冲引起的计算机机壳的光圈耦合效应。分析了耦合电场随时间的变化和分布图。讨论了传播方向和极化方向对箱体内耦合电场的影响,并给出了最强和最弱的耦合方法。所有这些都为研究计算机的电磁保护和电磁兼容性提供了量化依据。

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