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Optimization of Micro and Nano Research and Development Fabrication Operations

机译:微米和纳米研发制造操作的优化

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Abstract- In order to stay competitive in today's markets, companies are faced with lowering the cost of research and development while increasing technology capacity, reducing research lot cycle times and maintaining process control, and improving quality of numerous technology platforms. This poster will present an overview of the strategy and outcome of a multi year effort to improve the productivity of General Electric's Global Research Center (GRC) micro and nano systems technology (MNST) semiconductor cleanroom operations. A lean six-sigma approach was used to identify and analyze metrics that would lead to an understanding of factors critical to fab efficiency. Initiatives showed areas of improvement to be centered around: cleanroom equipment, fab lot loading/priority, documentation, and equipment. Further analysis revealed key metrics to analyze and track performance as, throughput, equipment uptime, process time, and process lot queue time. After implementing this lean six sigma approach metric data showed an initial cycle time improvement of more than 3X, a 41% queue time reduction from 2006 to 2009 and a 30% productivity improvement while realizing an overall fab loading increase of 54% from 2006 to 2009.
机译:摘要-为了在当今市场上保持竞争力,公司面临着降低研发成本,同时提高技术能力,缩短研究周期,维护过程控制以及提高众多技术平台质量的挑战。该海报将概述为提高通用电气全球研究中心(GRC)微米和纳米系统技术(MNST)半导体洁净室操作效率而进行的多年努力的战略和成果。精益六西格玛方法用于识别和分析指标,从而有助于理解对工厂效率至关重要的因素。各项举措表明,需要改进的地方集中在:洁净室设备,晶圆厂的批次装载/优先级,文档和设备。进一步的分析显示了用于分析和跟踪性能的关键指标,例如吞吐量,设备正常运行时间,处理时间和处理批次队列时间。实施这种精益的6 sigma方法后,指标数据显示初始周期时间提高了3倍以上,从2006年到2009年减少了41%的排队时间,并提高了30%的生产率,同时实现了从2006年到2009年的总体晶圆厂装载量增加了54% 。

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