An uncooled 1280 × 1024 InGaAs focal plane array for small platform, shortwave infrared imaging

摘要

The increasing demand for short wave infrared (SWIR) imaging technology for soldier-based and unmanned platforms requires camera systems where size, weight and power consumption are minimized without loss of performance. Goodrich, Sensors Unlimited Inc. reports on the development of a novel focal plane (FPA) array for DARPA's MISI (Micro-Sensors for Imaging) Program. This large format (1280 × 1024) array is optimized for dayight imaging in the wavelength region from 0.4 μm to 1.7 μm and consists of an InGaAs detector bump bonded to a capacitance transimpedance amplifier (CTIA)-based readout integrated circuit (ROIC) on a compact 15 μm pixel pitch. Two selectable integration capacitors provide for high dynamic range with low (< 50 electrons) noise, and expanded on-chip ROIC functionality includes analog-to-digital conversion and temperature sensing. The combination of high quality, low dark current InGaAs with temperature-parameterized non-uniformity correction allows operation at ambient temperatures while eliminating the need for thermoelectric cooling. The resulting lightweight, low power implementation is suitable for man-portable and UAV-mounted applications.