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High Precision CD Matching Monitoring Technology using Profile Gradient Method for the 32 nm Technology Generation

机译:使用轮廓梯度法的高精度CD匹配监控技术用于32 nm技术的产生

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Measurement uncertainty requirement 0.37 nm has been set for the Critical Dimension (CD) metrology tool in 32 nm technology generation, according to the ITRS. The continual development in the fundamental performance of Critical Dimension Scanning Electron Microscope (CD-SEM) is essential, as in the past, and for this generation, a highly precise tool management technology that monitors and corrects the tool-to-tool CD matching will also be indispensable. The potential factor that strongly influences tool-to-tool matching is the slight difference in the electron beam resolution, and its determination by visual confirmation is not possible from the SEM images. Thus, a method for quantitative evaluation of the resolution variation was investigated and Profile Gradient (PG) method was developed. In its development, considerations were given to its sensitivity against CD variation and its data sampling efficiency to achieve a sufficient precision, speed and practicality for a monitoring function that would be applicable to mass semiconductor production line. The evaluation of image sharpness difference was confirmed using this method. Furthermore, regarding the CD matching management requirements, this method has high sensitivity against CD variation and is anticipated as a realistic monitoring method that is more practical than monitoring the actual CD variation in mass semiconductor production line.
机译:据ITRS称,对于32纳米技术中的关键尺寸(CD)度量工具,已将测量不确定度要求设置为0.37 nm。与过去一样,临界尺寸扫描电子显微镜(CD-SEM)的基本性能的不断发展至关重要,而对于这一代人来说,一种高度精确的工具管理技术将监视并校正工具对工具CD的匹配情况。也是必不可少的。强烈影响工具间匹配的潜在因素是电子束分辨率的细微差别,并且无法通过SEM图像通过视觉确认来确定。因此,研究了一种对分辨率变化进行定量评估的方法,并开发了轮廓梯度(PG)方法。在其开发中,考虑了其对CD变化的敏感性以及其数据采样效率,以实现适用于大规模半导体生产线的监视功能所需的足够的精度,速度和实用性。使用该方法确认了图像清晰度差异的评价。此外,关于CD匹配管理要求,该方法对CD变化具有很高的敏感性,并且被期望作为一种现实的监视方法,其比监视大容量半导体生产线中的实际CD变化更实用。

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